HumiSeal UV40-SOLAR is a single component, low viscosity, high solids conformal coating material that has been formulated for use under prolonged exposure to sunlight, without discoloration or degradation. It meets the requirements of SAE-J-1960 standard (QUV accelerated age testing). In addition, the coating possesses excellent chemical resistance, surface hardness, flexibility, moisture resistance and is tack-free after exposure to UV light. A secondary moisture cure mechanism will cure unexposed areas within 2-3 days at ambient conditions. HumiSeal® UV40-SOLAR is in full compliance with the RoHS Directive 2002/95/EC.
Cleanliness of the substrate is of extreme importance for the successful application of a conformal coating. Surfaces must be free of moisture, dirt, wax, grease, flux residues and all other contaminants. Contamination under the coating could cause problems that may lead to assembly failures.
HumiSeal® UV40-SOLAR should be applied by standard selective coating equipment. The source air used for spraying must be dry (a dry inert gas is highly recommended) to prevent premature curing of the secondary cure mechanism. The spraying should be done with adequate ventilation so that the vapour and mist are carried away from the operator.
To flush equipment and clean uncured HumiSeal® UV40-SOLAR, non-alcohol based solvents should be used. HumiSeal® Thinner 600 is recommended.
HumiSeal® UV40-SOLAR is a highly cross linked UV cured coating. The cured film has a high degree of environmental and chemical resistance and will be more difficult to remove than traditional conformal coatings. Thermal displacement and mechanical abrasion are suitable options for rework of HumiSeal® UV40-SOLAR.
|Minimum Solids Content||95 %|
|Viscosity, per Fed-Std-141, Meth. 4287||650 ± 150 centipoise|
|Recommended Coating Thickness||25-125 microns|
|Recommended UV Dose*||1-4 J/cm2|
|Shelf Life at Room Temperature, DOM||12 months|
|Thermal Shock, 50 cycles per MIL-I-46058C||-65ºC to 125ºC|
|Glass Transition Temperature – DSC||45ºC|
|Coefficient of Thermal Expansion – TMA||85 ppm/ºC Below Tg|
197 ppm/ºC Above Tg
|Modulus – DMA||10364 MPa @ -40°C|
4283 MPa @ 25°C
66 MPa @ 80°C
|Dielectric Withstand Voltage, per MIL-I-46058C||>1500 votls|
|Dielectric Constant, at 1MHz and 25°C per ASTM D150-98||2.5|
|Dissipation Factor, at 1MHz and 25°C per ASTM D150-98||0.01|
|Insulation Resistance, per MIL-I-46058C||8.0 x 1014 ohms (800TΩ)|
|Moisture Insulation Resistance, per MIL-I-46058C||4.7 x 1010 ohms (60GΩ)|
|Fungus Resistance, per ASTM G21||Pass|
*Fusion “H” style bulb recommended