HumiSeal 1C49LV is a moisture curing, low viscosity, VOC-free silicone conformal coating which provides excellent moisture and environmental protection for printed circuit assemblies. HumiSeal® 1C49LV is solvent free. The coating demonstrates outstanding flexibility, fluoresces under UV light for ease of inspection and can be repaired. HumiSeal® 1C49LV can be cured at room or at elevated temperatures. HumiSeal® 1C49LV is MIL-I-46058C qualified, IPC-CC-830 and RoHS Directive 2011/65/EC compliant, and recognized under UL File Number E105698.
Cleanliness of the substrate is extremely important to the successful application of a conformal coating. Surfaces should be free of moisture, dirt, wax, grease and all other contaminants. Otherwise, ionic or organic residues on the substrate could be trapped under the coating and cause problems with adhesion or electrical properties. The highest long term reliability for a coated printed circuit assembly will be when the conformal coating is applied over a clean, dry substrate.
The application of conformal coatings over no clean flux is a common practice. The user should perform adequate testing to confirm compatibility between the conformal coating and their particular assembly materials and process conditions. Please contact HumiSeal for additional information.
Uniformity of the film depends on component density and operator’s technique.
A controlled rate of immersion and withdrawal (5-15 cm/min) will ensure even deposition of the coating and ultimately a uniform film. Blanketing dip tanks with an inert gas such as nitrogen can extend pot life.
HumiSeal® 1C49LV may be applied using most conventional spraying equipment. When in doubt, test the ability of the spray equipment before applying coating to production boards. Spraying should be done in an environment with adequate ventilation so that the vapour and mist are carried away from the operator. The use of thinner is not required or recommended for HumiSeal® 1C49LV.
|Density, per ASTM D1475||0.97 ± 0.03 g/cm³|
|Min. Solids Content, % by weight per Fed-Std-141, Meth. 4044||90 %|
|Viscosity, per Fed-Std-141, Meth. 4287||550 ± 250 centipoise|
|Recommended Coating Thickness||50 – 200 microns|
|Drying Time to Handle per Fed-Std-141, Meth. 4061||60 min|
|Recommended Curing Conditions||24 hrs @ RT or 20 min @ 76°C*|
|Time required to Reach Optimum Properties||7 days|
|Recommended Stripper||HumiSeal Stripper 1090|
|Shelf Life at Room Temperature, DOM||12 months|
|Thermal Shock, 50 cycles per MIL-I-46058C||-65°C to 200°C|
|Coefficient of Thermal Expansion – TMA||323 ppm /ºC above Tg|
|Glass Transition Temperature – DSC||< -65°C|
|Modulus – DMA||9.0 MPa @ -40ºC|
3.8 MPa @ 25ºC
3.2 MPa @ 80ºC
|Tensile, per ASTM D412||30-50 psi|
|Elongation, per ASTM D412||80-120 %|
|Flammability, per UL94||V-0|
|Dielectric Withstand Voltage, per MIL-I-46058C||>1500 volts|
|Dielectric Breakdown Voltage, per ASTM D149||7000 volts|
|Dielectric Constant, at 1MHz and 25°C per ASTM D150-98||2.5|
|Dissipation Factor, at 1MHz and 25°C per ASTM D150-98||0.01|
|Insulation Resistance, per MIL-I-46058C||5.0 x 1014 ohms (500TΩ)|
|Moisture Insulation Resistance, per MIL-I-46058C||1.0 x 1010 ohms (10GΩ)|
|Fungus Resistance, per ASTM G21||Passes|
* Place an open pan of water in the oven during curing