Dynastrip™ DL9150 is a cutting edge technology that yields optimal clean surface results without using hydroxyl amine or tetramethyl ammonium hydroxide (TMAH) . Dynastrip DL9150 combines outstanding cleaning with metal compatibility while raising the bar for environmental , health and safety (EH&S) compliance.
Post silicon DRIE residue removal
Liquid or Dry Film photoresist removal
Cu pillar process
Electroplated Pb free solder bump
Rapid dissolution of crosslinked photoresist
Outstanding compatibility with Cu, Sn, Ag
Fit for use with exposed polyimide